The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Nov. 29, 2021
Infineon Technologies Ag, Neubiberg, DE;
Chau Fatt Chiang, Melaka, MY;
Thorsten Meyer, Regensburg, DE;
Chan Lam Cha, Melaka, MY;
Wern Ken Daryl Wee, Melaka, MY;
Chee Hong Lee, Melaka, MY;
Swee Kah Lee, Melaka, MY;
Norliza Morban, Melaka, MY;
Khay Chwan Andrew Saw, Melaka, MY;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A method of forming a semiconductor package includes providing a metal baseplate having a base section and a plurality of metal posts, the base section being a planar pad of substantially uniform thickness, the plurality of metal posts each extending up from a planar upper surface of the base section, mounting a semiconductor die on the upper surface of the metal baseplate, forming an encapsulant body of electrically insulating mold compound on the upper surface of the base section, electrically connecting terminals of the semiconductor die to the metal posts, and removing the base section so as to form package contacts from the metal posts at a first surface of the encapsulant body.