Khay Chwan Andrew Saw

Title: Innovations by Khay Chwan Andrew Saw

Introduction

Khay Chwan Andrew Saw is a notable inventor based in Melaka, Malaysia. He has made significant contributions to the field of semiconductor technology, holding a total of four patents. His work focuses on innovative packaging solutions for electronic components, which are crucial for the advancement of modern electronics.

Latest Patents

Among his latest patents, one is titled "Semiconductor packages and methods for manufacturing thereof." This patent describes a package that includes a dielectric carrier, an electronic component mounted on the dielectric carrier, and an encapsulant that encapsulates at least part of the dielectric carrier and the electronic component. The corresponding methods of manufacturing the package are also detailed. Another significant patent is "Semiconductor package with metal posts from structured leadframe." This patent outlines a method of forming a semiconductor package that involves providing a metal baseplate with a base section and multiple metal posts. The process includes mounting a semiconductor die on the upper surface of the metal baseplate and forming an encapsulant body of electrically insulating mold compound.

Career Highlights

Khay Chwan Andrew Saw is currently employed at Infineon Technologies AG, where he continues to innovate in the semiconductor industry. His expertise and contributions have positioned him as a key player in the development of advanced semiconductor packaging technologies.

Collaborations

He collaborates with talented coworkers, including Chau Fatt Chiang and Norliza Morban, who contribute to the innovative projects at Infineon Technologies AG.

Conclusion

Khay Chwan Andrew Saw's work in semiconductor packaging exemplifies the importance of innovation in technology. His patents reflect a commitment to advancing the field and improving electronic component manufacturing processes.