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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12021000 B1

PDFFull Text
Date of Patent:
Jun. 25, 2024

Filed:

Jul. 28, 2021

Semiconductor package and method for fabricating a semiconductor package

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Khay Chwan Andrew Saw, Melaka, MY;

Chau Fatt Chiang, Melaka, MY;

Norliza Morban, Melaka, MY;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Murphy, Bilak & Homiller, PLLC

Primary Examiner:

Trang Q Tran

Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3107 (2013.01); H01L 21/4832 (2013.01); H01L 21/56 (2013.01); H01L 23/5389 (2013.01); H01L 24/06 (2013.01); H01L 24/48 (2013.01); H01L 24/97 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/97 (2013.01); H01L 2924/181 (2013.01);
Abstract

A semiconductor package includes a semiconductor die, an encapsulation encapsulating the semiconductor die, the encapsulation having a first side and an opposing second side, a plurality of contact pads for electrically contacting the semiconductor die, the contact pads being arranged on the first side of the encapsulation, and a plurality of inspection holes arranged in communication with the contact pads and extending from the first side to the second side, such that solder joints on the first side of the encapsulation are optically inspectable using the inspection holes viewed from the second side of the encapsulation.

Find Patent Forward Citations

Saw, Khay Chwan Andrew. (2024). Semiconductor package and method for fabricating a semiconductor package (U.S. Patent No. 12021000). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12021000

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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