Norliza Morban

Title: Norliza Morban: Innovator in Semiconductor Technology

Introduction

Norliza Morban is a prominent inventor based in Melaka, Malaysia. He has made significant contributions to the field of semiconductor technology, holding a total of seven patents. His work focuses on innovative packaging solutions that enhance the performance and reliability of electronic components.

Latest Patents

Among his latest patents are two notable inventions. The first is a semiconductor package that includes a dielectric carrier, an electronic component mounted on the carrier, and an encapsulant that encapsulates both the carrier and the electronic component. This invention also describes the corresponding methods for manufacturing the package. The second patent involves a semiconductor package with metal posts derived from a structured leadframe. This method includes providing a metal baseplate with a planar pad and multiple metal posts, mounting a semiconductor die, and forming an encapsulant body on the base section. The invention allows for efficient electrical connections and the formation of package contacts.

Career Highlights

Norliza Morban is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His expertise in semiconductor packaging has positioned him as a key player in the industry, contributing to advancements that benefit various electronic applications.

Collaborations

He collaborates with talented coworkers, including Cher Hau Danny Koh and Si Hao Vincent Yeo, who share his passion for innovation in semiconductor technology.

Conclusion

Norliza Morban's contributions to semiconductor technology through his patents and work at Infineon Technologies AG highlight his role as an influential inventor in the field. His innovative approaches continue to shape the future of electronic components.