The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2016
Filed:
Apr. 17, 2014
Infineon Technologies Ag, Neubiberg, DE;
Chee Hoe Mak, Durian Tunggal, MY;
Ryan Ross Alinea, Las Pinas, PH;
Yun Yann Ng, Sungai Rambai, MY;
Norliza Morban, Kg. Pernu, MY;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A universal lead frame for semiconductor packages includes a solid lead frame sheet comprising an electrically conductive material and a plurality of columns etched into the lead frame sheet and distributed with a predetermined lead pitch so that the universal lead frame has a solid first main side opposite the columns and a patterned second main side opposite the first main side. A method of manufacturing the universal lead frame includes providing a solid lead frame sheet of an electrically conductive material and etching a plurality of columns into the lead frame sheet so that the columns are distributed with a predetermined lead pitch and the universal lead frame has a solid first main side opposite the columns and a patterned second main side opposite the first main side. A method of manufacturing molded semiconductor packages using the universal lead frame is also provided.