The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2025

Filed:

Aug. 06, 2019
Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Chau Fatt Chiang, Melaka, MY;

Paul Armand Asentista Calo, Melaka, MY;

Kok Yau Chua, Melaka, MY;

Josef Hoeglauer, Heimstetten, DE;

Swee Kah Lee, Melaka, MY;

Khay Chwan Saw, Melaka, MY;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49562 (2013.01); H01L 21/4825 (2013.01); H01L 23/4952 (2013.01); H01L 23/49575 (2013.01);
Abstract

In an embodiment, a leadframe includes a first electrically conductive part and a second electrically conductive part, each having an outer surface arranged to provide substantially coplanar outer contact areas having a footprint and an inner surface opposing the outer surface, the first part being spaced apart from the second part by a gap, a first recess arranged in the inner surface of the first part, a second recess arranged in the inner surface of the second part, and a first electrically conductive insert that is arranged in, and extends between, the first recess and the second recess and bridges the gap between the first part and the second part.


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