The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 16, 2021

Filed:

Oct. 22, 2019
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Sook Woon Chan, Melaka, MY;

Chau Fatt Chiang, Melaka, MY;

Kok Yau Chua, Melaka, MY;

Swee Kah Lee, Melaka, MY;

Chee Yang Ng, Muar, MY;

Assignee:

INFINEON TECHNOLOGIES AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); H04R 31/00 (2006.01); H04R 19/04 (2006.01); H04R 19/00 (2006.01); B81B 7/02 (2006.01); B81C 1/00 (2006.01); G01L 19/00 (2006.01); H01L 29/84 (2006.01); H04R 1/08 (2006.01); H04R 1/04 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0064 (2013.01); B81B 7/0035 (2013.01); B81B 7/0058 (2013.01); B81B 7/02 (2013.01); B81C 1/00269 (2013.01); G01L 19/0084 (2013.01); H01L 29/84 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01); H04R 31/00 (2013.01); H04R 1/04 (2013.01); H04R 1/086 (2013.01);
Abstract

An embodiment device includes a body structure having an interior cavity, a control chip disposed on a first interior surface of the interior cavity, and a sensor attached, at a first side, to a second interior surface of the interior cavity opposite the first interior surface. The sensor has a mounting pad on a second side of the sensor that faces the first interior surface, and the sensor is vertically spaced apart from the control chip by an air gap, with the sensor is aligned at least partially over the control chip. The device further includes an interconnect having a first end mounted on the mounting pad, the interconnect extending through the interior cavity toward the first interior surface, and the control chip is in electrical communication with the sensor by way of the interconnect.


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