The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

Jul. 11, 2018
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Maciej Wojnowski, Munich, DE;

Dirk Hammerschmidt, Finkerstein, AT;

Walter Hartner, Bad Abbach-Peissing, DE;

Johannes Lodermeyer, Kinding, DE;

Chiara Mariotti, Villach, AT;

Thorsten Meyer, Regensburg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); H01P 3/16 (2006.01); H01Q 3/44 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01P 3/16 (2013.01); H01L 23/66 (2013.01); H01Q 3/44 (2013.01); H01L 2223/6677 (2013.01);
Abstract

A semiconductor device including an Integrated Circuit (IC) package and a plastic waveguide. The IC package includes a semiconductor chip; and an embedded antenna formed within a Redistribution Layer (RDL) coupled to the semiconductor chip, wherein the RDL is configured to transport a Radio Frequency (RF) signal between the semiconductor chip and the embedded antenna. The plastic waveguide is attached to the IC package and configured to transport the RF signal between the embedded antenna and outside of the IC package.


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