The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2020
Filed:
Nov. 06, 2018
Intel Ip Corporation, Santa Clara, CA (US);
Georg Seidemann, Landshut, DE;
Christian Geissler, Teugn, DE;
Sven Albers, Regensburg, DE;
Thomas Wagner, Regensburg, DE;
Marc Dittes, Regensburg, DE;
Klaus Reingruber, Langquaid, DE;
Andreas Wolter, Regensburg, DE;
Richard Patten, Langquaid, DE;
Intel IP Corporation, Santa Clara, CA (US);
Abstract
Disclosed is a package comprising a substrate having a patterned surface with an optical contact area, an optical redistribution layer (oRDL) feature, and a build-up material extending over the patterned surface of the substrate and around portions of the oRDL features. In some embodiments, the package comprises a liner sheathing the oRDL features. In some embodiments, the oRDL feature extends through openings in an outer surface of the build-up material and forms posts extending outward from the outer surface. In some embodiments, the package comprises an electrical redistribution layer (eRDL) feature, at least some portion of which overlap at least some portion of the oRDL feature. In some embodiments, the package comprises an optical fiber coupled to the oRDL features.