Landshut, Germany

Georg Seidemann

This inventor holds 87 USPTO granted patents and 49 published patent applications and 4 EPO patents, primarily in Semiconductor Packaging (CPC class H01L23-49816). Top assignees: Intel Corporation, Infineon Technologies Ag, Intel IP Corporation. Active years: 2010-2026.

USPTO Granted Patents = 87 

% Patents Active = 77.0

 

Average Co-Inventor Count = 4.3

ph-index = 5

Forward Citations = 141(Granted Patents)

Forward Citations (Not Self Cited) = 110(Dec 10, 2025)


Inventors with similar research interests:

🔬 See more inventors

Location History:

  • Laudshut, DE (2010)
  • Landshut, DE (2010 - 2024)

Company Filing History:


Years Active: 2010-2026

Loading Chart...
Loading Chart...
Areas of Expertise:
Semiconductor Devices
Heat Dissipation
Inductive Coupling
Wafer-Level Packages
Microelectronic Assemblies
Integrated Circuit Packages
Antenna Design
Chip-to-Wafer Bonding
Smart Bridge
Thermal Contacts
Interconnect Structures
Fan Out Packaging
87 patents (USPTO):Explore Patents

Title: **Innovative Contributions of Georg Seidemann in Microelectronics**

Introduction

Georg Seidemann, based in Landshut, Germany, is an accomplished inventor with an impressive portfolio of 70 patents. His work primarily focuses on advancements in microelectronic assemblies and antenna technologies. With a blend of creativity and technical expertise, he has significantly contributed to the field of electronics.

Latest Patents

Among his recent patents, Georg Seidemann has introduced innovative designs such as the "Microelectronic assemblies having topside power delivery structures." This patent outlines a microelectronic assembly featuring a package substrate that includes a conductive pathway linked to a power source and multiple embedded microelectronic components. The design incorporates through-substrate vias (TSVs) and redistribution layers, enhancing the efficiency of power delivery in microelectronic assemblies.

Another noteworthy patent is the "Antenna with graded dielectric and method of making the same." This patent describes a novel packaging design that includes a ground layer of metal over a chip, combined with an antenna element and a dielectric lens featuring graded dielectric constants. This innovative structure aims to improve the performance of antennas in various applications.

Career Highlights

Throughout his career, Georg Seidemann has made impactful contributions while working with leading technology companies such as Intel Corporation and Infineon Technologies AG. His experience at these firms has enabled him to refine his skills in microelectronics and technology development.

Collaborations

Georg has collaborated with notable coworkers including Andreas Wolter and Bernd Waidhas. Their partnerships have likely fostered a creative environment, driving forward inventive solutions in their respective projects and enhancing the products offered by their companies.

Conclusion

Georg Seidemann continues to be an influential figure in the field of microelectronics, with his extensive patent portfolio attesting to his innovative spirit. His latest inventions showcase a commitment to pushing the boundaries of technology, ultimately benefiting the industry and consumers alike.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to [email protected]
Loading…