The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2025
Filed:
Sep. 24, 2021
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Peter Baumgartner, Munich, DE;
Joachim Assenmacher, Unterhaching, DE;
Walther Lutz, Erding, DE;
Martin Ostermayr, Woerth, DE;
Georg Seidemann, Landshut, DE;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H10D 84/40 (2025.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H10D 1/20 (2025.01);
U.S. Cl.
CPC ...
H10D 84/40 (2025.01); H01L 23/5227 (2013.01); H01L 23/53257 (2013.01); H10D 1/20 (2025.01);
Abstract
A semiconductor die is disclosed, including a plurality of transistors at a frontside of a semiconductor substrate, a backside inductor at a backside of the semiconductor substrate; and a frontside inductor at the frontside of the semiconductor substrate. The frontside inductor and the backside inductor are inductively coupled.