The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2026
Filed:
Mar. 24, 2022
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Carlton Hanna, San Jose, CA (US);
Wolfgang Molzer, Ottobrunn, DE;
Stefan Reif, Munich, DE;
Georg Seidemann, Landshut, DE;
Stephan Stoeckl, Schwandorf, DE;
Pouya Talebbeydokhti, Gilbert, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3732 (2013.01); H01L 23/367 (2013.01);
Abstract
A semiconductor package comprises a package substrate comprised of at least a first layer of dielectric material including a portion of diamond dust material. The diamond dust material is comprised of diamond dust particles. The semiconductor package includes at least one electrical connection coupled through layers of the package substrate.