Stephan Stoeckl

Title: The Innovations of Stephan Stoeckl

Introduction

Stephan Stoeckl is a notable inventor based in Schwandorf, Germany. He has made significant contributions to the field of semiconductor packaging, holding a total of 10 patents. His work focuses on innovative solutions that enhance the performance and reliability of electronic devices.

Latest Patents

One of his latest patents is titled "Stress relief die implementation." This invention includes semiconductor packages, specifically a wafer level chip scale package (WLCSP). The WLCSP comprises a die with an active surface and a backside surface, featuring a first coefficient of thermal expansion (CTE). Additionally, the WLCSP incorporates a channel filled with a stress relief material that has a second CTE greater than the first CTE. Another significant patent is "Patch antennas stitched to systems in packages and methods of assembling same." This patent describes a patch antenna array fabricated with a package-on-package setup containing a transceiver. The array's footprint intersects with the transceiver footprint, and the setup includes through-mold vias that couple to a redistribution layer between the patch antennas and the package-on-package setup.

Career Highlights

Stephan Stoeckl has worked with prominent companies in the technology sector, including Intel Corporation and Infineon Technologies AG. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

Throughout his career, Stoeckl has collaborated with talented individuals such as Georg Seidemann and Bernd Waidhas. These partnerships have contributed to the advancement of his projects and the successful implementation of his inventions.

Conclusion

Stephan Stoeckl's contributions to semiconductor packaging through his patents and collaborations highlight his role as a leading inventor in the field. His innovative solutions continue to impact the technology landscape positively.