The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2022
Filed:
Mar. 31, 2017
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Andreas Augustin, Munich, DE;
Sonja Koller, Regensburg, DE;
Bernd Waidhas, Pettendorf, DE;
Georg Seidemann, Landshut, DE;
Andreas Wolter, Regensburg, DE;
Stephan Stoeckl, Schwandorf, DE;
Thomas Wagner, Regelsbach, DE;
Josef Hagn, Neubiberg, DE;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 9/04 (2006.01); H01L 23/00 (2006.01); H01Q 1/22 (2006.01); H01Q 21/06 (2006.01);
U.S. Cl.
CPC ...
H01Q 9/0414 (2013.01); H01L 24/85 (2013.01); H01Q 1/2283 (2013.01); H01Q 21/065 (2013.01); H01L 2924/15311 (2013.01);
Abstract
A patch antenna array is fabricated with a package-on-package setup that contains a transceiver. The patch antenna array has a footprint that intersects the transceiver footprint. The package-on-package setup includes through-mold vias that couple to a redistribution layer disposed between the patch antennas and the package-on-package setup.