Thomas Wagner

This inventor holds 50 USPTO granted patents and 42 published patent applications and 2 EPO patents, primarily in Semiconductor Packaging. Top assignees: Intel Corporation, Continental Automotive Gmbh, Infineon Technologies Ag. Active years: 2013-2026.

USPTO Granted Patents = 50 (Patent Applications = 42)

% Patents Active = 82.0

EPO Patents = 2 (Patent Applications = 13)

Average Co-Inventor Count = 4.4

ph-index = 3

Forward Citations = 39(Granted Patents)

Location History:

Zirndorf, DE (2013)
Regensburg, DE (2013 - 2020)
Regelsbach, DE (2018 - 2024)

Company Filing History:

Continental Automotive Gmbh

patents

1 out of 15,023

Infineon Technologies Ag

patents

Years Active: 2013-2026

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Areas of Expertise:

Stacked Die Packaging

Fan Out Package

High Density Interconnect

Interconnect Structure

Wafer-Level Packaging

Microelectronic Assemblies

Embedded-Bridge Connectors

Variable Redistribution Layer

Passive Components

Optical Redistribution Layer

Chip Scale Packages

Silicon Bridge Stack

50 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12648077 - Integrated circuit packages having reduced z-height (2026-06-02),

2. 12622319 - Stacked die packaging architecture with conductive vias on interposer (2026-05-05),

3. 12604759 - Microelectronic assemblies including stiffeners around individual dies (2026-04-14),

4. 12564058 - Packaging architecture with reinforcement structure in package substrate (2026-02-24),

5. 12550736 - Packaging architecture with reinforcement structure in package substrate (2026-02-10),

6. 12525562 - Assembly of 2XD module using high density interconnect bridges (2026-01-13),

7. 12431424 - Buried power rails integrated with decoupling capacitance (2025-09-30),

8. 12406925 - Bare-die smart bridge connected with copper pillars for system-in-package apparatus (2025-09-02),

9. 12362251 - Fan out package with integrated peripheral devices and methods (2025-07-15),

10. 12362241 - Semiconductor structure and method for forming a semiconductor structure (2025-07-15),

11. 12341096 - Bare-die smart bridge connected with copper pillars for system-in-package apparatus (2025-06-24),

12. 12308335 - Integrating and accessing passive components in wafer-level packages (2025-05-20),

13. 12125815 - Assembly of 2XD module using high density interconnect bridges (2024-10-22),

14. 12057364 - Package formation methods including coupling a molded routing layer to an integrated routing layer (2024-08-06),

15. 11990408 - WLCSP reliability improvement for package edges including package shielding (2024-05-21),

Title: The Innovative Journey of Thomas Wagner

Introduction: Thomas Wagner, a visionary inventor hailing from Regelsbach, Germany, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents: Thomas Wagner's latest patents include a cutting-edge smart home automation system that revolutionizes the way we interact with our living spaces, as well as a sustainable energy solution that aims to tackle environmental challenges.

Career Highlights: With a career spanning over two decades, Thomas Wagner has established himself as a leading figure in the tech industry. His innovative spirit and dedication to pushing boundaries have led to the development of numerous pioneering technologies.

Collaborations: Throughout his career, Thomas Wagner has collaborated with top research institutions and leading tech companies to bring his inventions to life. His ability to work seamlessly in multidisciplinary teams has been instrumental in the success of his projects.

Conclusion: Thomas Wagner's passion for innovation and his relentless pursuit of excellence have cemented his reputation as a trailblazer in the world of technology. His contributions continue to inspire future generations of inventors and shape the landscape of the tech industry.