The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2025
Filed:
Dec. 17, 2021
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Georg Seidemann, Landshut, DE;
Thomas Wagner, Regelsbach, DE;
Andreas Wolter, Regensburg, DE;
Bernd Waidhas, Pettendorf, DE;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 21/56 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/532 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01); H01L 25/16 (2023.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 21/561 (2013.01); H01L 21/76885 (2013.01); H01L 23/00 (2013.01); H01L 23/481 (2013.01); H01L 23/53228 (2013.01); H01L 23/5385 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 25/16 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 24/96 (2013.01); H01L 2224/02371 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01);
Abstract
A system-in-package apparatus includes a semiconductive bridge that uses bare-die pillars to couple with a semiconductive device such as a processor die. The apparatus achieves a thin form factor.