The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2026

Filed:

Mar. 20, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Pouya Talebbeydokhti, Gilbert, AZ (US);

Mohan Prashanth Javare Gowda, Ottobrunn, DE;

Sonja Koller, Bavaria, DE;

Stephan Stoeckl, Schwandorf, DE;

Thomas Wagner, Regelsbach, DE;

Wolfgang Molzer, Ottobrunn, DE;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/053 (2006.01); H01L 23/00 (2006.01); H01L 23/06 (2006.01); H01L 23/10 (2006.01); H01L 23/13 (2006.01); H01L 23/31 (2006.01); H01L 25/10 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/053 (2013.01); H01L 23/06 (2013.01); H01L 23/10 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/105 (2013.01); H01L 23/13 (2013.01); H01L 23/3142 (2013.01); H01L 23/481 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/1611 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/1631 (2013.01); H01L 2924/16315 (2013.01); H01L 2924/1632 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/35121 (2013.01); H01L 2924/37001 (2013.01);
Abstract

Disclosed herein are microelectronic assemblies, as well as related apparatuses and methods. In some embodiments, a microelectronic assembly may include a substrate; a lid surrounding an individual die, wherein the lid includes a planar portion and two or more sides extending from the planar portion, and wherein the individual die is electrically coupled to the substrate by interconnects; and a material surrounding the interconnects and coupling the two or more sides of the lid to the substrate.


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