Ottobrunn, Germany

Wolfgang Molzer

USPTO Granted Patents = 10 

Average Co-Inventor Count = 4.9

ph-index = 3

Forward Citations = 31(Granted Patents)


Company Filing History:


Years Active: 2004-2025

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10 patents (USPTO):

Title: Wolfgang Molzer: Innovator in Integrated Circuit Technology

Introduction

Wolfgang Molzer is a prominent inventor based in Ottobrunn, Germany. He holds a total of 10 patents that showcase his contributions to the field of integrated circuit technology. His innovative work has significantly impacted the design and functionality of semiconductor devices.

Latest Patents

Among his latest patents, Wolfgang has developed technologies such as "Buried power rails integrated with decoupling capacitance." This invention discloses integrated circuit (IC) devices that include buried power rails (BPRs) with integrated decoupling capacitance. An example IC device features a first layer comprising a transistor and a support structure adjoining the first layer. The support structure includes BPRs, which are power rails buried in the support structure, and a decoupling capacitor based on the BPRs. The conductive cores of the BPRs serve as the electrodes of the decoupling capacitor, while the dielectric barriers of the BPRs can function as the dielectric of the decoupling capacitor. Additionally, the IC device may include another decoupling capacitor at the backside of the support structure, providing additional decoupling capacitance for stabilizing power supply facilitated by the BPRs.

Another notable patent is related to "Stress relief die implementation." This invention includes semiconductor packages, specifically a wafer level chip scale package (WLCSP). The WLCSP comprises a die with an active surface and a backside surface, possessing a first coefficient of thermal expansion (CTE). The WLCSP further includes a channel into the die, filled with a stress relief material that has a second CTE greater than the first CTE.

Career Highlights

Wolfgang Molzer has worked with leading technology companies, including Intel Corporation and Infineon Technologies AG. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

Throughout his career, Wolfgang has collaborated with notable professionals in the field, including Reinhard Mahnkopf and Edmund Goetz. These collaborations have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Wolfgang Molzer's contributions to integrated circuit technology through his patents and collaborations highlight his role as a significant innovator in the field. His work continues to influence the design and functionality of

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