The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2015
Filed:
Sep. 26, 2013
Intel Ip Corporation, Santa Clara, CA (US);
Georg Seidemann, Landshut, DE;
Sven Albers, Regensburg, DE;
Teodora Ossiander, Sinzing, DE;
Michael Skinner, San Jose, CA (US);
Hans-Joachim Barth, Munich, DE;
Harald Gossner, Reimerling, DE;
Reinhard Mahnkopf, Oberhaching, DE;
Christian Mueller, Bottrop, DE;
Wolfgang Molzer, Ottobrunn, DE;
Intel IP Corporation, Santa Clara, CA (US);
Abstract
An apparatus comprises a first integrated circuit (IC) die that includes a top layer, a bottom surface, a sidewall surface extending from a top surface of the top layer to the bottom surface, and at least one multi-surface contact pad, a second IC die including a top layer, a bottom surface, a sidewall surface extending from a top surface of the top layer to the bottom surface, and at least one multi-surface contact pad, wherein the second IC die is arranged adjacent to the first IC die, and includes an electrically conductive bond in contact with at least one of the top surface or the side surface of the multi-surface contact pad of the first IC die and the top surface of the multi-surface contact pad of the second IC die.