The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2016
Filed:
Sep. 25, 2013
Applicants:
Wolfgang Molzer, Ottobrunn, DE;
Edmund Goetz, Dachau, DE;
Reinhard Mahnkopf, Oberhaching, DE;
Bernd Memmler, Riemerling, DE;
Inventors:
Wolfgang Molzer, Ottobrunn, DE;
Edmund Goetz, Dachau, DE;
Reinhard Mahnkopf, Oberhaching, DE;
Bernd Memmler, Riemerling, DE;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15311 (2013.01);
Abstract
Via are described for radio frequency antenna connections related to a package. In one example, a package has a package substrate, a die attached to the package substrate, and a conductive via from the package substrate to an external surface of the package to make a radio frequency connection between the antenna and the package substrate.