Dachau, Germany

Edmund Goetz

USPTO Granted Patents = 9 

Average Co-Inventor Count = 4.3

ph-index = 4

Forward Citations = 42(Granted Patents)


Company Filing History:


Years Active: 1996-2025

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9 patents (USPTO):

Certainly! Here is an article about inventor Edmund Goetz:

Title: Innovator Spotlight: The Contributions of Edmund Goetz

Introduction: Edmund Goetz, a prolific inventor based in Dachau, Germany, has made significant contributions to the field of semiconductor technology. With a total of 8 patents to his name, Goetz's innovative work has made a lasting impact on the industry.

Latest Patents: Among his latest patents is the groundbreaking invention of "Radio frequency shielding within a semiconductor package." This invention involves a multiple chip package consisting of a digital chip, a radio frequency chip, and an isolation layer between them, all enclosed within a cover. This technology has the potential to revolutionize the efficiency and performance of semiconductor devices.

Career Highlights: Goetz's professional journey includes notable stints at renowned companies such as Intel Corporation and Intel IP Corporation. His expertise and groundbreaking inventions have helped shape the technological landscape of these organizations, solidifying his reputation as a key figure in the industry.

Collaborations: Throughout his career, Goetz has collaborated with esteemed professionals in the field, including coworkers such as Bernd Memmler and Wolfgang Molzer. These collaborations have not only enriched his work but have also fostered a culture of innovation and excellence within the teams he has been a part of.

Conclusion: In conclusion, Edmund Goetz's innovative spirit and dedication to advancing semiconductor technology have established him as a trailblazer in the industry. His patents and contributions continue to inspire future generations of inventors and serve as a testament to the power of innovation in driving progress and change in the world of technology.

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