Intel Corporation

Siemens Aktiengesellschaft

Edmund Goetz

Bernd Memmler

Peter Baumgartner

Jan-Erik Mueller

Reinhard Mahnkopf

Wolfgang Molzer

Thorsten Meyer

Hans-Joachim Barth

Sven Albers

Stefan Beyer

Markus Scholz

Shen Feng

Gunter Donig

Georg Lipperer

Helmut Herrmann

Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.

Radio frequency shielding within a semiconductor package

Embodiments of the present description include stacked microelectronic dice embedded in a microelectronic substrate and methods of fabricating the same. In one embodiment, at least one first microelectronic die is attached to a second microelectronic die, wherein an underfill material is provided between the second microelectronic die and the at least one first microelectronic die. The microelectronic substrate is then formed by laminating the first microelectronic die and the second microelectronic die in a substrate material.

Methods of forming stacked microelectronic dice embedded in a microelectronic substrate

Stacked microelectronic dice embedded in a microelectronic substrate

Via are described for radio frequency antenna connections related to a package. In one example, a package has a package substrate, a die attached to the package substrate, and a conductive via from the package substrate to an external surface of the package to make a radio frequency connection between the antenna and the package substrate.

Package vias for radio frequency antenna connections

A frequency synthesizer for a radio terminal with which a dual-band and/or dual-mode switchover is possible in a simple manner. The frequency synthesizer has a double phase-locked loop with a high-frequency portion and an intermediate-frequency portion, each with one divider and one counter in a feedback branch. There is at least one memory for holding a plurality of divider values for the counter in the intermediate-frequency portion. The counter in the high-frequency portion is coupled to the memory in such a way that when a new divider value is written into the counter of the high-frequency portion, an associated divider value from the memory is written into the counter of the intermediate-frequency portion. In this way, the frequency generated by the intermediate-frequency divider is adapted to the frequency generated in the high-frequency portion in such a way that the requisite operating frequencies of each active mobile radio system are set automatically. In the same way, the dual-mode switchover can be carried out by coupling a further memory with further divider values for the counter of the high-frequency portion.

Frequency synthesizer with a phase-locked loop for receiving and processing signals in different frequency bands

A circuit configuration generates an even-numbered duty factor with an odd-numbered division n of a symmetrical clock signal. A first device generates a first output signal from the symmetrical clock signal. The first output signal begins upon each n.sup.th edge of one type, of a symmetrical clock signal and remains active for a length of N-1/2 periods of the symmetrical clock signal. A second device generates a second output signal from the symmetrical clock signal. The second output signal begins upon each n.sup.th edge of another type, of the symmetrical clock signal and remains active for the length of N-1/2 periods of the symmetrical clock signal. A logic linkage is connected to the first and second devices for linking the two output signals to form one symmetrical output signal.

Circuit configuration for generating even-numbered duty factors

Growing community of inventors

Dachau, Germany

Edmund Goetz