The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2025

Filed:

Dec. 17, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Richard Geiger, Munich, DE;

Klaus Herold, Munich, DE;

Harald Gossner, Riemerling, DE;

Martin Ostermayr, Woerth, DE;

Georgios Panagopoulos, Munich, DE;

Johannes Rauh, Kirchseeon, DE;

Joachim Singer, Neubiberg, DE;

Thomas Wagner, Regelsbach, DE;

Assignee:

Intel corporation, Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 21/66 (2006.01); H01L 23/48 (2006.01); H01L 29/10 (2006.01);
U.S. Cl.
CPC ...
H01L 22/32 (2013.01); H01L 23/481 (2013.01);
Abstract

A semiconductor structure is provided. The semiconductor structure includes a plurality of transistors arranged at a front side of a semiconductor substrate and a test structure located at the front side of the semiconductor substrate. Further, the semiconductor structure comprises a first electrically conductive connection extending from the test structure through the semiconductor substrate to a backside test pad arranged at a backside of the semiconductor substrate.


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