The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2018
Filed:
Dec. 29, 2016
Applicant:
Intel Ip Corporation, Santa Clara, CA (US);
Inventors:
Bernd Waidhas, Pettendorf, DE;
Stephan Stoeckl, Schwandorf, DE;
Andreas Wolter, Regensburg, DE;
Reinhard Mahnkopf, Oberhaching, DE;
Georg Seidemann, Landshut, DE;
Thomas Wagner, Regelsbach, DE;
Laurent Millou, Munich, DE;
Assignee:
Intel IP Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/06 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/053 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 21/4846 (2013.01); H01L 23/053 (2013.01); H01L 23/5387 (2013.01); H01L 24/14 (2013.01); H01L 24/48 (2013.01); H01L 25/0655 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48137 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15738 (2013.01); H01L 2924/3025 (2013.01);
Abstract
A bent-bridge semiconductive apparatus includes a silicon bridge that is integral to a semiconductive device and the silicon bridge is deflected out of planarity. The silicon bridge may couple two semiconductive devices, all of which are from an integral processed die.