The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2016
Filed:
May. 16, 2014
Intel Corporation, Santa Clara, CA (US);
Sven Albers, Regensburg, DE;
Georg Seidemann, Landshut, DE;
Sonja Koller, Regensburg, DE;
Stephan Stoeckl, Schwandorf, DE;
Shubhada H. Sahasrabudhe, Gilbert, AZ (US);
Sandeep B. Sane, Chandler, AZ (US);
INTEL CORPORATION, Santa Clara, CA (US);
Abstract
Disclosed herein are contact pads for use with integrated circuit (IC) packages. In some embodiments, a contact pad disclosed herein may be disposed on a substrate of an IC package, and may include a metal projection portion and a metal recess portion. Each of the metal projection portion and the metal recess portion may have a solder contact surface. The solder contact surface of the metal recess portion may be spaced away from the solder contact surface of the metal projection portion. Related devices and techniques are also disclosed herein, and other embodiments may be claimed.