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For the Inventor, By the Inventor

Gilbert, AZ, United States of America

Shubhada H Sahasrabudhe

This inventor holds 8 USPTO granted patents and 2 published patent applications. Top assignee: Intel Corporation. Active years: 2008-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shubhada H Sahasrabudhe. Retrieved from https://idiyas.com/inventor/shubhada-h-sahasrabudhe

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 8 

% Patents Active = 62.5

Average Co-Inventor Count = 3.1

ph-index = 2

Forward Citations = 9(Granted Patents)


Company Filing History:

goldMedal8 out of 56,394 
 
Intel Corporation
 patents

Years Active: 2008-2022

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8 patents (USPTO):Explore Patents
1. 11469185 - Standoff members for semiconductor package (2022-10-11),
2. 11276625 - Methods of forming flexure based cooling solutions for package structures (2022-03-15),
3. 10181432 - Computing system with a thermal interface comprising magnetic particles (2019-01-15),
4. 10177066 - Flexible integrated heat spreader (2019-01-08),
5. 9953934 - Warpage controlled package and method for same (2018-04-24),
6. 9659908 - Systems and methods for package on package through mold interconnects (2017-05-23),
7. 9368461 - Contact pads for integrated circuit packages (2016-06-14),
8. 7411296 - Method, system, and apparatus for gravity assisted chip attachment (2008-08-12),

Title: Innovations by Shubhada H Sahasrabudhe

Introduction

Shubhada H Sahasrabudhe is a prominent inventor based in Gilbert, AZ (US). He has made significant contributions to the field of semiconductor technology, holding a total of 8 patents. His work focuses on enhancing the performance and reliability of semiconductor packages.

Latest Patents

One of his latest patents is titled "Standoff members for semiconductor package." This invention involves semiconductor packages that include support members designed to mitigate damage to a semiconductor die mounted on the package. The support members can be arranged at specific locations on a frame layer, which acts as a stiffener for the package. These members can be made from the same material as the frame layer or a different one, and they can be mounted on various surfaces to provide optimal support.

Another notable patent is "Methods of forming flexure based cooling solutions for package structures." This patent describes methods and structures for joining package components, featuring a cooling structure that includes a first section attached to a substrate and a second section on the die. The design incorporates flexure beam structures that connect these sections, enhancing the cooling efficiency of the semiconductor package.

Career Highlights

Shubhada H Sahasrabudhe is currently employed at Intel Corporation, a leading company in semiconductor manufacturing. His innovative work has contributed to advancements in the industry, particularly in the design and functionality of semiconductor packages.

Collaborations

He has collaborated with notable coworkers such as Sandeep B Sane and Siddarth Kumar, further enriching his contributions to the field.

Conclusion

Shubhada H Sahasrabudhe's innovative patents and career at Intel Corporation highlight his significant impact on semiconductor technology. His work continues to pave the way for advancements in the industry, ensuring greater reliability and performance in semiconductor packages.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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