The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2019

Filed:

Mar. 02, 2017
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Ameya Limaye, Chandler, AZ (US);

Shubhada Sahasrabudhe, Gilbert, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/36 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 25/07 (2006.01); H01L 23/367 (2006.01); H01L 25/04 (2014.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 21/4871 (2013.01); H01L 21/4882 (2013.01); H01L 23/315 (2013.01); H01L 23/3121 (2013.01); H01L 23/3164 (2013.01); H01L 23/367 (2013.01); H01L 24/17 (2013.01); H01L 24/32 (2013.01); H01L 25/042 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/83409 (2013.01); H01L 2224/83447 (2013.01);
Abstract

A thermal management solution may be provided for a microelectronic system including a flexible integrated heat spreader, wherein the flexible integrated heat spreader may comprise a plurality of thermally conductive structures having a flexible thermally conductive film attached to and extending between each of the plurality of thermally conductive structures. The flexible integrated heat spreader may be incorporated into multi-chip package by providing a microelectronic substrate having a plurality of microelectronic devices attached thereto and by thermally contacting each of the plurality of thermally conductive structures of the flexible integrated heat spreader to its respective microelectronic device on the microelectronic substrate.


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