The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2022

Filed:

Sep. 29, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Siddarth Kumar, Chandler, AZ (US);

Shubhada H. Sahasrabudhe, Gilbert, AZ (US);

Sandeep B. Sane, Chandler, AZ (US);

Shalabh Tandon, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/40 (2006.01); H01L 21/48 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4006 (2013.01); H01L 21/4882 (2013.01); H01L 23/427 (2013.01); H01L 2023/4062 (2013.01); H01L 2023/4068 (2013.01); H01L 2023/4087 (2013.01);
Abstract

Methods/structures of joining package structures are described. Those methods/structures may include a first side of a die disposed on a first side of a substrate, and a cooling structure on a second side of the die, wherein the cooling structure comprises a first section attached to the substrate, and a second section disposed on a second side of the die, wherein the first and second sections are separated by an opening in the cooling structure. The opening surrounds a portion of the second section, and at least one flexure beam structure connects the first and second sections.


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