Company Filing History:
Years Active: 2006-2022
Title: Shalabh Tandon: Innovator in Cooling Solutions
Introduction
Shalabh Tandon is a prominent inventor based in Chandler, AZ, known for his contributions to the field of cooling solutions in package structures. With a total of five patents to his name, Tandon has made significant strides in enhancing the efficiency and effectiveness of electronic packaging.
Latest Patents
Tandon's latest patents include innovative methods for forming flexure-based cooling solutions for package structures. These methods describe a configuration where a die is placed on a substrate, with a cooling structure positioned on the opposite side. The cooling structure features a first section attached to the substrate and a second section that is separated by an opening, which surrounds a portion of the second section. Additionally, Tandon has developed a warp-controlled package that utilizes counter moment elements to counteract warping caused by heat application. This design ensures that the substrate maintains its integrity while accommodating the necessary devices and electrical contacts.
Career Highlights
Shalabh Tandon has built a successful career at Intel Corporation, where he has been instrumental in advancing packaging technologies. His work focuses on creating solutions that address the challenges of heat management in electronic devices, making him a valuable asset to the company.
Collaborations
Tandon collaborates with talented colleagues, including Siddarth Kumar and Sandeep B Sane, to drive innovation and develop cutting-edge technologies in the field of electronic packaging.
Conclusion
Shalabh Tandon's contributions to the field of cooling solutions and electronic packaging highlight his role as a leading inventor. His innovative patents and collaborative efforts at Intel Corporation continue to shape the future of technology.