The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2020
Filed:
Mar. 21, 2017
Applicant:
Intel Ip Corporation, Santa Clara, CA (US);
Inventors:
Bernd Waidhas, Pettendorf, DE;
Georg Seidemann, Landshut, DE;
Andreas Wolter, Regensburg, DE;
Thomas Wagner, Regelsbach, DE;
Stephan Stoeckl, Schwandorf, DE;
Laurent Millou, Munich, DE;
Assignee:
Intel IP Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/538 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 25/00 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/49816 (2013.01); H01L 23/5381 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/96 (2013.01); H01L 25/50 (2013.01); H01L 24/81 (2013.01); H01L 24/95 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/16268 (2013.01); H01L 2224/2711 (2013.01); H01L 2224/27334 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/32148 (2013.01); H01L 2224/32238 (2013.01); H01L 2224/32268 (2013.01); H01L 2224/73203 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/81001 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/95001 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/181 (2013.01);
Abstract
An embedded-bridge substrate connector apparatus includes a patterned reference layer to which a first module and a subsequent module are aligned and the two modules are mated at the patterned reference layer. At least one module includes a silicon bridge connector that bridges to two devices, through the patterned reference layer, to the mated module.