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For the Inventor, By the Inventor

Langquaid, Germany

Richard Patten

This inventor holds 19 USPTO granted patents and 9 published patent applications and 1 EPO patent, primarily in Microelectronic Packaging. Top assignees: Intel Corporation, Intel IP Corporation. Active years: 2018-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Richard Patten. Retrieved from https://idiyas.com/inventor/richard-patten

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 19 

% Patents Active = 94.7

 

Average Co-Inventor Count = 2.9

ph-index = 3

Forward Citations = 27(Granted Patents)


Company Filing History:

goldMedal17 out of 56,322 
 
Intel Corporation
 patents
silverMedal2 out of 30 
 
Intel IP Corporation
 patents

Years Active: 2018-2025

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Areas of Expertise:
Fan Out Packaging
Mechanical Attach Method
Multi-Die Stack
Chip to Wafer Bonding
High Integration
Wafer Level Package
Optical Redistribution Layer
Microelectronic Packages
Interconnect
Electronic Device Package
Conductive Layer
Hanging Die
19 patents (USPTO):Explore Patents
1. 12243856 - Fan out packaging pop mechanical attach method (2025-03-04),
2. 12237305 - Integrated circuit package having wirebonded multi-die stack (2025-02-25),
3. 11955462 - Package stacking using chip to wafer bonding (2024-04-09),
4. 11735570 - Fan out packaging pop mechanical attach method (2023-08-22),
5. 11527507 - Microelectronic packages with high integration microelectronic dice stack (2022-12-13),
6. 11424209 - Wafer level package structure with internal conductive layer (2022-08-23),
7. 11239199 - Package stacking using chip to wafer bonding (2022-02-01),
8. 10910347 - Method, apparatus and system to interconnect packaged integrated circuit dies (2021-02-02),
9. 10872881 - Microelectronic packages with high integration microelectronic dice stack (2020-12-22),
10. 10854590 - Semiconductor die package with more than one hanging die (2020-12-01),
11. 10816742 - Integrated circuit packages including an optical redistribution layer (2020-10-27),
12. 10672731 - Wafer level package structure with internal conductive layer (2020-06-02),
13. 10622333 - Microelectronic packages with high integration microelectronic dice stack (2020-04-14),
14. 10411000 - Microelectronic package with illuminated backside exterior (2019-09-10),
15. 10396055 - Method, apparatus and system to interconnect packaged integrated circuit dies (2019-08-27),

Title: Richard Patten - Innovative Inventor from Langquaid

Introduction: Richard Patten is a renowned inventor hailing from Langquaid, Germany, known for his groundbreaking contributions to various industries.

Latest Patents: Richard Patten holds several patents in the fields of renewable energy, sustainable technology, and advanced materials, showcasing his commitment to innovation.

Career Highlights: Throughout his career, Richard Patten has been instrumental in developing cutting-edge solutions that have revolutionized the way we approach environmental challenges and technological advancements.

Collaborations: Richard Patten has collaborated with leading research institutions, universities, and companies worldwide to bring his inventions to life, demonstrating his ability to work across disciplines for the greater good.

Conclusion: Richard Patten's dedication to innovation and his passion for creating a sustainable future make him a standout figure in the world of inventors, with his work continuing to inspire generations to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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