The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 10, 2019

Filed:

Mar. 31, 2016
Applicant:

Intel Ip Corporation, Santa Clara, CA (US);

Inventors:

Marc Stephan Dittes, Regensburg, DE;

Sven Albers, Regensburg, DE;

Christian Georg Geissler, Teugn, DE;

Andreas Wolter, Regensburg, DE;

Klaus Reingruber, Langquaid, DE;

Georg Seidemann, Landshut, DE;

Thomas Wagner, Regelsbach, DE;

Richard Patten, Langquaid, DE;

Assignee:

Intel IP Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 15/00 (2015.01); H01L 25/16 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 23/3128 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73257 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01);
Abstract

A microelectronic package is described with an illuminated backside exterior. In one example, the package has a package substrate, a die attached to the package substrate, a cover over the die and the package substrate, a lamp, and a screen over the die, externally visible and optically coupled to the lamp so that when the lamp is illuminated the illumination is externally visible through the screen.


Find Patent Forward Citations

Loading…