The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2022
Filed:
Dec. 26, 2015
Intel Corporation, Santa Clara, CA (US);
Georg Seidemann, Landshut, DE;
Klaus Reingruber, Langquaid, DE;
Christian Geissler, Teugn, DE;
Sven Albers, Regensburg, DE;
Andreas Wolter, Regensburg, DE;
Marc Dittes, Regensburg, DE;
Richard Patten, Langquaid, DE;
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments are generally directed to package stacking using chip to wafer bonding. An embodiment of a device includes a first stacked layer including one or more semiconductor dies, components or both, the first stacked layer further including a first dielectric layer, the first stacked layer being thinned to a first thickness; and a second stacked layer of one or more semiconductor dies, components, or both, the second stacked layer further including a second dielectric layer, the second stacked layer being fabricated on the first stacked layer.