The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2011
Filed:
Oct. 25, 2007
Edmund Riedl, Gebelkofen, DE;
Joachim Mahler, Regensburg, DE;
Johannes Lodermeyer, Kinding, DE;
Mathias Vaupel, Regensburg, DE;
Steffen Jordan, Sinzing, DE;
Edmund Riedl, Gebelkofen, DE;
Joachim Mahler, Regensburg, DE;
Johannes Lodermeyer, Kinding, DE;
Mathias Vaupel, Regensburg, DE;
Steffen Jordan, Sinzing, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor package includes a leadframe defining a die pad, a chip electrically coupled to the die pad, encapsulation material covering the chip and the die pad, and a plurality of lead ends exposed relative to the encapsulation material and configured for electrical communication with the chip, and a nitrogen-containing hydrocarbon coating disposed over at least the lead ends of the leadframe, where the hydrocarbon coating is free of metal particles.