Location History:
- Sinzing, DE (2011)
- Viehhausen, DE (2013 - 2019)
- Pielenhofen, DE (2023 - 2024)
Company Filing History:
Years Active: 2011-2025
Title: Steffen Jordan: Innovator in Electronic Packaging Solutions
Introduction
Steffen Jordan, an accomplished inventor based in Viehhausen, Germany, has made significant contributions to the field of electronic packaging. With a portfolio of eight patents, he is celebrated for his innovative methods that enhance the performance and reliability of electronic components in various applications.
Latest Patents
Among his latest inventions is a patent for a method of manufacturing a package featuring an adhesion promoter. This innovative process involves forming an adhesion promoter on at least part of an electronic component. The adhesion promoter employs a morphological structure with multiple openings, which significantly increases bonding strength. Moreover, the method ensures that the electronic component is at least partially encapsulated with an inorganic encapsulant, allowing the adhesion promoter to enhance the adhesion between the component and the encapsulant.
Another noteworthy patent by Jordan details a method of forming a chip package. This method consists of a malleable carrier that includes a layer of electrically conductive material. The malleable carrier is positively fitted to a chip, partially enclosing it, while the conductive layer contacts the chip's contacts, effectively forming a redistribution layer that improves electrical connections.
Career Highlights
Steffen Jordan has dedicated his professional career to Infineon Technologies AG, where he has played a vital role in advancing the company’s electronic packaging technologies. His innovative mindset and technical proficiency have led to a series of patents that address critical challenges in the industry, contributing to enhanced product performance and durability.
Collaborations
Throughout his career, Steffen has collaborated with talented colleagues, including Edmund Riedl and Thorsten Scharf. Together, they have worked on various projects that further the development of innovative electronic packaging solutions, fostering a collaborative environment that drives progress and creativity within Infineon Technologies AG.
Conclusion
Steffen Jordan stands out as a prominent inventor in the realm of electronic packaging innovations. With his recent patents, he continues to push the boundaries of what is possible in the industry, enhancing the reliability of electronic components. His dedication to innovation not only contributes to the advancement of technology but also sets a benchmark for future inventions in the field.