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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10366924 B1

PDFFull Text
Date of Patent:
Jul. 30, 2019

Filed:

May. 09, 2017

Chip carriers and semiconductor devices including redistribution structures with improved thermal and electrical performance

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Thorsten Scharf, Regensburg, DE;

Steffen Jordan, Viehhausen, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Dicke, Billig & Czaja, PLLC

Primary Examiner:

Edward Chin

Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 23/492 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 23/373 (2013.01); H01L 23/492 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 23/49844 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 24/03 (2013.01); H01L 24/06 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/36 (2013.01); H01L 25/0655 (2013.01); H01L 23/34 (2013.01); H01L 24/48 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73267 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01);
Abstract

A chip carrier includes a redistribution structure, wherein the redistribution structure includes: a dielectric layer extending in a horizontal direction; a first electrically conductive layer arranged over the dielectric layer and extending in the horizontal direction; a trench arranged in the dielectric layer and extending in the horizontal direction; and a filling material filling the trench, wherein the filling material is different from the material of the dielectric layer.

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Scharf, Thorsten. (2019). Chip carriers and semiconductor devices including redistribution structures with improved thermal and electrical performance (U.S. Patent No. 10366924). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10366924

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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