The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2019
Filed:
Feb. 18, 2017
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Thorsten Scharf, Regensburg, DE;
Steffen Jordan, Viehhausen, DE;
Wolfgang Schober, Amberg, DE;
Thomas Ziegler, Kelheim, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 23/538 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/08 (2013.01); H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 23/3157 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 24/03 (2013.01); H01L 24/06 (2013.01); H01L 24/17 (2013.01); H01L 24/43 (2013.01); H01L 24/45 (2013.01); H01L 24/83 (2013.01); H01L 25/0652 (2013.01); H01L 25/50 (2013.01); H01L 23/3128 (2013.01); H01L 23/49827 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05111 (2013.01); H01L 2224/05116 (2013.01); H01L 2224/05139 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/18 (2013.01); H01L 2924/01015 (2013.01);
Abstract
A package comprising an electronic chip, a laminate-type encapsulant at least partially encapsulating the electronic chip, a wiring structure extending from the electronic chip up to a contact pad, and a completely galvanically formed solderable exterior electric contact electrically coupled with the electronic chip by being arranged on the contact pad.