Thomas Ziegler

Title: Thomas Ziegler - Innovator in Chip Embedding Technology

Introduction

Thomas Ziegler is a notable inventor based in Kelheim, Germany. He has made significant contributions to the field of electronics, particularly in the area of chip embedding technology. His innovative work has led to the development of a unique patent that enhances the functionality and reliability of electronic devices.

Latest Patents

Thomas Ziegler holds a patent for a "Chip embedding package with solderable electric contact." This invention comprises an electronic chip, a laminate-type encapsulant that partially encapsulates the chip, and a wiring structure that extends from the chip to a contact pad. Additionally, it features a completely galvanically formed solderable exterior electric contact that is electrically coupled with the chip, arranged on the contact pad. This patent showcases his expertise in creating advanced electronic packaging solutions.

Career Highlights

Ziegler is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His role at Infineon has allowed him to work on cutting-edge technologies that drive innovation in the electronics industry. His contributions have been instrumental in advancing the company's product offerings and enhancing their market position.

Collaborations

Throughout his career, Thomas Ziegler has collaborated with talented professionals, including Thorsten Scharf and Steffen Jordan. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

In summary, Thomas Ziegler is a distinguished inventor whose work in chip embedding technology has made a significant impact in the electronics field. His patent and contributions at Infineon Technologies AG highlight his commitment to innovation and excellence.