The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2019
Filed:
Feb. 07, 2017
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Martin Gruber, Schwandorf, DE;
Steffen Jordan, Viehhausen, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/58 (2006.01); C23C 18/16 (2006.01); C25D 7/00 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 21/288 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); C23C 18/1653 (2013.01); C25D 7/00 (2013.01); H01L 21/2885 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 21/76802 (2013.01); H01L 21/76873 (2013.01); H01L 21/76877 (2013.01); H01L 23/3114 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 23/585 (2013.01); H01L 24/00 (2013.01); H01L 25/0655 (2013.01); H01L 23/3107 (2013.01); H01L 2221/68359 (2013.01);
Abstract
The method comprises providing a plurality of electronic devices, embedding the electronic devices in an encapsulation layer, forming vias into the encapsulation layer, the vias extending from a main face of the encapsulation layer to the electronic devices, and depositing a metallic layer onto the encapsulation layer including the vias by galvanic plating, the method further comprising providing a current distribution layer for effecting a distributed growth of the metallic material during the galvanic plating.