The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2013
Filed:
Oct. 07, 2008
Edmund Riedl, Obertraubling-Gebelkofen, DE;
Steffen Jordan, Viehhausen, DE;
Christof Matthias Schilz, Dresden, DE;
Fee Hoon Wong, Melaka, MY;
Edmund Riedl, Obertraubling-Gebelkofen, DE;
Steffen Jordan, Viehhausen, DE;
Christof Matthias Schilz, Dresden, DE;
Fee Hoon Wong, Melaka, MY;
Infineon Technologies, AG, Neubiberg, DE;
Abstract
A semiconductor package includes a semiconductor component including a circuit carrier with a plurality of inner contact pads, a semiconductor chip, and a plurality of electrical connections. An adhesion promotion layer is disposed on at least areas of the semiconductor component and a plastic encapsulation material encapsulates at least the semiconductor chip, the plurality of electrical connections and the plurality of the inner contact pads. Surface regions of the semiconductor component are selectively activated.