The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2015

Filed:

Dec. 08, 2011
Applicants:

Ralf Otremba, Kaufbeuren, DE;

Josef Hoeglauer, Heimstetten, DE;

Joachim Mahler, Regensburg, DE;

Johannes Lodermeyer, Regensburg, DE;

Inventors:

Ralf Otremba, Kaufbeuren, DE;

Josef Hoeglauer, Heimstetten, DE;

Joachim Mahler, Regensburg, DE;

Johannes Lodermeyer, Regensburg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/72 (2006.01); H01L 23/00 (2006.01); H01L 23/492 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01); H01L 21/56 (2006.01); H01L 25/07 (2006.01); H01L 25/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/96 (2013.01); H01L 23/492 (2013.01); H01L 21/4857 (2013.01); H01L 23/5389 (2013.01); H01L 23/3107 (2013.01); H01L 21/568 (2013.01); H01L 25/071 (2013.01); H01L 25/50 (2013.01); H01L 2224/40227 (2013.01); H01L 2224/24105 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/82106 (2013.01); H01L 2224/24135 (2013.01); H01L 2224/40105 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/24 (2013.01); H01L 24/73 (2013.01); H01L 24/82 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/14181 (2013.01); H01L 2224/24011 (2013.01); H01L 2224/2402 (2013.01); H01L 2224/245 (2013.01); H01L 2224/73209 (2013.01); H01L 2224/96 (2013.01); H01L 2224/1411 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73267 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/1305 (2013.01);
Abstract

A device includes a first power semiconductor chip with a first contact pad and a second contact pad on a first face and a third contact pad on the second face. The device further includes a second power semiconductor chip with a first contact pad and a second contact pad on a first face and a third contact pad on the second face. The first and second power semiconductor chips are arranged one above another, and the first face of the first power semiconductor chip faces in the direction of the first face of the second power semiconductor chip. In addition, the first power semiconductor chip is located laterally at least partially outside of the outline of the second power semiconductor chip.


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