The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2020
Filed:
Aug. 10, 2017
Infineon Technologies Ag, Neubiberg, DE;
Ludwig Heitzer, Falkenfels, DE;
Derek Debie, Bogen, DE;
Klaus Elian, Alteglofsheim, DE;
Cyrus Ghahremani, Regensburg, DE;
Johannes Lodermeyer, Kinding, DE;
Oskar Neuhoff, Nittendorf, DE;
Johann Strasser, Schierling, DE;
Infineon Technologies AG, , DE;
Abstract
A microelectromechanical systems (MEMS) package assembly and a method of manufacturing the same is provided. The MEMS package assembly includes a substrate, a housing coupled to the substrate to form a cavity, wherein the housing includes a transparent plate disposed above and parallel to the substrate and is configured to permit a transmission of light therethrough, and a MEMS chip disposed within the cavity and including a first main surface proximal to the transparent plate and a second main surface opposite to the first main surface and coupled to the substrate. The MEMS chip is oriented such that the first main surface is tilted at a tilt angle with respect to the transparent plate.