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For the Inventor, By the Inventor

Wuppertal, Germany

Ludwig Heitzer

This inventor holds 22 USPTO granted patents and 5 published patent applications, primarily in Semiconductor Technology. Top assignees: Infineon Technologies Ag, Infineon Technologies Dresden Gmbh & Co . Kg, Intel Mobile Communications Gmbh. Active years: 2007-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ludwig Heitzer. Retrieved from https://idiyas.com/inventor/ludwig-heitzer

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 22 

% Patents Active = 45.5

Average Co-Inventor Count = 3.7

ph-index = 4

Forward Citations = 121(Granted Patents)


Location History:

  • Regensburg, DE (2007 - 2012)
  • Falkensfels, DE (2018)
  • Falkenfels, DE (2012 - 2020)

Company Filing History:

goldMedal20 out of 15,027 
 
Infineon Technologies Ag
 patents
silverMedal1 out of 61 
 
Infineon Technologies Dresden Gmbh & Co . Kg
 patents
bronzeMedal1 out of 511 
 
Intel Mobile Communications Gmbh
 patents

Years Active: 2007-2025

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Areas of Expertise:
Semiconductor Device
Particle Measurement
Molded Package
Radiation Source
Optical Devices
Semiconductor Battery
Electronic Component
VQFN Design
Packaging Techniques
Heat Dissipation
Manufacturing Methods
Thinned Chip
22 patents (USPTO):Explore Patents
1. 12405202 - Semiconductor device for particle measurement and method for operating the semiconductor device (2025-09-02),
2. 12283538 - Molded semiconductor package having an embedded inlay (2025-04-21),
3. 12158448 - Radiation source device (2024-12-03),
4. 10571682 - Tilted chip assembly for optical devices (2020-02-25),
5. 10424819 - Semiconductor battery and semiconductor device including a semiconductor battery (2019-09-24),
6. 10043768 - Semiconductor device and method of manufacture thereof (2018-08-07),
7. 9881909 - Method for attaching a semiconductor die to a carrier (2018-01-30),
8. 9576935 - Method for fabricating a semiconductor package and semiconductor package (2017-02-21),
9. 9030019 - Semiconductor device and method of manufacture thereof (2015-05-12),
10. 8421226 - Device including an encapsulated semiconductor chip and manufacturing method thereof (2013-04-16),
11. 8330260 - Electronic component of VQFN design and method for producing the same (2012-12-11),
12. 8173488 - Electronic device and method of manufacturing same (2012-05-08),
13. 7919857 - Plastic housing and semiconductor component with said plastic housing (2011-04-05),
14. 7834460 - Method for manufacturing an electronic component and corresponding electronic component (2010-11-16),
15. 7749864 - Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip (2010-07-06),

Title: The Innovative Journey of Ludwig Heitzer

Introduction: Ludwig Heitzer, a pioneering inventor hailing from Wuppertal, Germany, has made significant contributions to the world of technology and innovation.

Latest Patents: Ludwig Heitzer's latest patents focus on renewable energy solutions and sustainable transportation methods, showcasing his commitment to environmental conservation.

Career Highlights: Throughout his illustrious career, Ludwig Heitzer has been recognized for his groundbreaking work in the fields of clean energy, smart infrastructure, and advanced materials.

Collaborations: Heitzer has collaborated with leading research institutions, universities, and tech companies to bring his innovative ideas to life, fostering a culture of creativity and progress in the industry.

Conclusion: Ludwig Heitzer's passion for innovation and his dedication to creating a more sustainable future continue to inspire generations of inventors and entrepreneurs around the globe.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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