The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2010
Filed:
May. 09, 2007
Michael Bauer, Nittendorf, DE;
Ludwig Heitzer, Regensburg, DE;
Christian Stuempfl, Schwandorf, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
The invention pertains to a method for manufacturing an electronic component with a semiconductor element () that is contacted and fixed on a substrate surface (). The method is characterized in that the rear side of the semiconductor element and/or the substrate surface is coated with an adhesive structure consisting of a first component () that solidifies, particularly hardens or cures, and an electrically conductive second component () that does not solidify, wherein the semiconductor element is bonded to the substrate surface in a contacting fashion. The electronic component is characterized in that a structured adhesive layer arranged between the semiconductor element and the substrate surface comprises a solidifying first component () and an electrically conductive non-solidifying second component ().