The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2012

Filed:

Sep. 30, 2008
Applicants:

Michael Bauer, Nittendorf, DE;

Ludwig Heitzer, Falkenfels, DE;

Daniel Porwol, Straubing, DE;

Inventors:

Michael Bauer, Nittendorf, DE;

Ludwig Heitzer, Falkenfels, DE;

Daniel Porwol, Straubing, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

This application relates to a method of manufacturing a semiconductor device comprising: providing multiple chips each comprising contact elements on a first main face of each of the multiple chips, and a first layer applied to each of the first main faces of the multiple chips; placing the multiple chips over a carrier with the first layers facing the carrier; applying encapsulation material to the multiple chips and the carrier to form an encapsulation workpiece embedding the multiple chips; and removing the carrier from the encapsulation workpiece.


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