Daniel Porwol

This inventor holds 17 USPTO granted patents and 2 published patent applications and 1 EPO patent. Top assignees: Infineon Technologies Ag, Intel Mobile Communications Gmbh. Active years: 2011-2024.

USPTO Granted Patents = 17 (Patent Applications = 2)

% Patents Active = 70.6

EPO Patents = 1 (Patent Applications = 2)

Average Co-Inventor Count = 3.4

ph-index = 3

Forward Citations = 34(Granted Patents)

Company Filing History:

16 out of 15,013

Infineon Technologies Ag

patents

1 out of 511

Intel Mobile Communications Gmbh

patents

Years Active: 2011-2024

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17 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12112992 - Package having an electronic component and an encapsulant encapsulating a dielectric layer and a semiconductor die of the electronic component (2024-10-08),

2. 11605572 - Electronic component with semiconductor die having a low ohmic portion with an active area and a high ohmic portion on a dielectric layer (2023-03-14),

3. 11279120 - Device and method for debonding a structure from a main surface region of a carrier (2022-03-22),

4. 10694584 - Infrared emitter arrangement and method for producing an infrared emitter arrangement (2020-06-23),

5. 10600690 - Method for handling a product substrate and a bonded substrate system (2020-03-24),

6. 10483133 - Method for fabricating a semiconductor chip panel (2019-11-19),

7. 10332814 - Bonded system and a method for adhesively bonding a hygroscopic material (2019-06-25),

8. 10056295 - Method for handling a product substrate, a bonded substrate system and a temporary adhesive (2018-08-21),

9. 9988262 - Temporary mechanical stabilization of semiconductor cavities (2018-06-05),

10. 9981843 - Chip package and a method of producing the same (2018-05-29),

11. 9953846 - Method for fabricating a semiconductor chip panel (2018-04-24),

12. 9455160 - Method for fabricating a semiconductor chip panel (2016-09-27),

13. 8906749 - Method for fabricating a semiconductor device (2014-12-09),

14. 8394308 - Mold method (2013-03-12),

15. 8173488 - Electronic device and method of manufacturing same (2012-05-08),

Title: The Innovative Mind of Daniel Porwol

Introduction: Daniel Porwol, a talented inventor hailing from Straubing, Germany, is known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Daniel Porwol's latest patents include a cutting-edge smart home automation system that revolutionizes the way we interact with our living spaces, and a unique renewable energy solution that promises to reshape the future of sustainable power generation.

Career Highlights: With a career spanning over two decades, Daniel Porwol has established himself as a visionary in the tech industry. His work has garnered international recognition and has been instrumental in shaping the landscape of modern technology.

Collaborations: Throughout his career, Daniel Porwol has collaborated with leading tech companies, research institutions, and universities to bring his innovative ideas to life. His ability to work seamlessly in multidisciplinary teams has led to the successful development of groundbreaking technologies.

Conclusion: Daniel Porwol's relentless passion for innovation and his unwavering commitment to pushing the boundaries of what is possible make him a true pioneer in the world of technology. His contributions continue to inspire and shape the future of innovation.