logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12112992 B1

PDFFull Text
Date of Patent:
Oct. 08, 2024

Filed:

Feb. 09, 2023

Package having an electronic component and an encapsulant encapsulating a dielectric layer and a semiconductor die of the electronic component

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Daniel Porwol, Straubing, DE;

Thomas Fischer, Regensburg, DE;

Uwe Seidel, Munich, DE;

Anton Steltenpohl, Munich, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Murphy, Bilak & Homiller, PLLC

Primary Examiner:

William A Harriston

Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/683 (2006.01); H01L 23/29 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3164 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 23/3192 (2013.01); H01L 21/6836 (2013.01); H01L 23/295 (2013.01); H01L 24/02 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68368 (2013.01); H01L 2224/02377 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/10252 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10254 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10335 (2013.01);
Abstract

A package includes: an electronic component that includes a dielectric layer as a base and a semiconductor die attached on top of the dielectric layer, the semiconductor die having an active area with monolithically integrated circuit elements; and an encapsulant encapsulating the dielectric layer and the semiconductor die. The encapsulant is a mold compound having different material properties than the dielectric layer. A method of manufacturing package is also described.

Find Patent Forward Citations

Porwol, Daniel. (2024). Package having an electronic component and an encapsulant encapsulating a dielectric layer and a semiconductor die of the electronic component (U.S. Patent No. 12112992). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12112992

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…