The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2018

Filed:

Jan. 20, 2016
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Georg Meyer-Berg, Munich, DE;

Claus von Waechter, Sinzing, DE;

Michael Bauer, Nittendorf, DE;

Holger Doepke, Sinzing, DE;

Dominic Maier, Pleystein, DE;

Daniel Porwol, Straubing, DE;

Tobias Schmidt, Regenstauf, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/683 (2006.01); B32B 37/26 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); B32B 37/26 (2013.01); H01L 21/565 (2013.01); H01L 21/6835 (2013.01); H01L 23/562 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); H05K 3/007 (2013.01); Y10S 156/93 (2013.01); Y10S 156/941 (2013.01);
Abstract

A method for handling a product substrate includes bonding a carrier to the product substrate. A layer of a permanent adhesive is applied onto a surface of the carrier. A structured intermediate layer is provided. The applied permanent adhesive bonds the carrier to the product substrate. The structured intermediate layer is arranged between the product substrate and the carrier. A surface of the structured intermediate layer and a surface of the permanent adhesive are in direct contact to a surface of the product substrate. The structured intermediate layer decreases a bonding strength between the product substrate and the carrier.


Find Patent Forward Citations

Loading…