Georg Meyer-Berg

This inventor holds 62 USPTO granted patents and 9 published patent applications, primarily in Semiconductor Devices (CPC class H01L). Top assignees: Infineon Technologies Ag, Intel Deutschland Gmbh, Infineon Technologies Austria Ag. Active years: 2002-2024.

USPTO Granted Patents = 62 (Patent Applications = 9)

% Patents Active = 67.7

Average Co-Inventor Count = 2.0

ph-index = 6

Forward Citations = 189(Granted Patents)

Forward Citations (Not Self Cited) = 176(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Müchen, DE (2008)
Muenchen, DE (2012)
München, DE (2002 - 2018)
Munich, DE (2007 - 2023)

Company Filing History:

55 out of 15,005

Infineon Technologies Ag

patents

3 out of 254

Intel Deutschland Gmbh

patents

2 out of 2,194

Infineon Technologies Austria Ag

Years Active: 2002-2024

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Areas of Expertise:

Semiconductor Device

Power Module

Chip Package

Integrated Circuit

Die Attach

Passive Component

Thermoplastic Dielectric

Battery State Detection

62 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12154878 - Semiconductor device (2024-11-26),

2. 11848294 - Semiconductor device (2023-12-19),

3. 11322451 - Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module (2022-05-03),

4. 11233027 - Semiconductor device (2022-01-25),

5. 11195787 - Semiconductor device including an antenna (2021-12-07),

6. 10854547 - Chip package with cross-linked thermoplastic dielectric (2020-12-01),

7. 10734352 - Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement (2020-08-04),

8. 10679959 - Semiconductor device (2020-06-09),

9. 10600690 - Method for handling a product substrate and a bonded substrate system (2020-03-24),

10. 10529678 - Semiconductor device (2020-01-07),

11. 10522447 - Chip package and a wafer level package (2019-12-31),

12. 10297564 - Semiconductor die attach system and method (2019-05-21),

13. 10211158 - Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module (2019-02-19),

14. 10177112 - Attaching chip attach medium to already encapsulated electronic chip (2019-01-08),

15. 10121690 - Method of manufacturing a semiconductor component and semiconductor component (2018-11-06),

Title: The Innovative Mind of Georg Meyer-Berg

Introduction: Georg Meyer-Berg, a distinguished inventor hailing from Munich, Germany, has made significant contributions to the world of technology and innovation.

Latest Patents: Georg Meyer-Berg's latest patents focus on renewable energy solutions, with a particular emphasis on solar power optimization and energy storage technologies.

Career Highlights: With a career spanning over two decades, Georg Meyer-Berg has been at the forefront of cutting-edge technological advancements. His work has revolutionized the way we harness and utilize renewable energy sources.

Collaborations: Throughout his career, Georg Meyer-Berg has collaborated with leading research institutions and universities to further his innovative projects. His partnerships have led to groundbreaking developments in the field of sustainable energy.

Conclusion: Georg Meyer-Berg's passion for innovation and commitment to sustainability have solidified his position as a visionary inventor in the realm of renewable energy technologies. His contributions continue to shape the future of clean energy solutions worldwide.