The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2019
Filed:
Oct. 05, 2017
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Joachim Mahler, Regensburg, DE;
Georg Meyer-Berg, Munich, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 5/06 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); C09J 163/00 (2006.01); C09J 177/04 (2006.01); C09J 179/02 (2006.01); C09J 181/00 (2006.01); C09J 183/04 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); C09J 5/06 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); C09J 163/00 (2013.01); C09J 177/04 (2013.01); C09J 179/02 (2013.01); C09J 181/00 (2013.01); C09J 183/04 (2013.01); C09J 2203/10 (2013.01); C09J 2463/00 (2013.01); C09J 2477/00 (2013.01); C09J 2479/00 (2013.01); C09J 2481/00 (2013.01); C09J 2483/00 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29388 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83851 (2013.01);
Abstract
A semiconductor package includes a semiconductor die, a substrate for supporting the semiconductor die, an encapsulant covering the semiconductor die and at least part of the substrate, and a die attach material attaching the semiconductor die to the substrate. The die attach material includes molecules having a first functional group with at least one free electron pair and a second functional group chemically reacted or reactable with the encapsulant in a way that promotes adhesion with the encapsulant. A corresponding method of manufacturing the semiconductor package is also described.